APPLICATION FOCUS: DRILLING MICROVIAS IN BOROSILICATE GLASS

Precision processing of glass components is of significant commercial interest for the manufacturing of integrated components for telecommunications and biomedical applications. Femtosecond lasers offer an ideal solution for these delicate glass processing applications.

Drilling microvias on 100 μm thick borosilicate glass

This application required drilling an array of microvias in a 100 µm thick borosilicate glass slide to create a micro-filter for use in medical applications. The requirement was to drill 15 µm holes separated by 50 µm over an area of 20 x 20 mm. The Quantronix Integra-C ultrafast laser (1 W at 1 kHz) was selected for this application. The Integra-C's ultrashort pulse width of 130 fs allowed for precisely drilled holes with no collateral damage to the surrounding material.

The Integra-C was equipped with a fixed beam delivery system and a 50 mm focal length to achieve the beam spot size of 15 µm. The sample was placed on an XY stage and a CNC program was used to control the drilling process. A gas-assist of approximately 10 bar was used to avoid any redeposition or debris falling on the glass slide.

The holes were drilled by exposing the focused laser beam to the glass slide for 250 msec (250 pulses). The beam penetrated the material with no chipping or cracking on the surface. The microvias were separated by 50 µm in both horizontal and vertical directions. The holes achieved are near cylindrical with an exit diameter of 12 µm. Thousands (~ 90,000) of holes were drilled with extreme precision and reproducibility (tolerance of ±1 µm) over an area of 20 x 20 mm.

Click here to read more about the Quantronix Integra-C Series.
 
 

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제조국 : USA

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